218 Publications
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| 218 Publications from Scopus |
This is a list of publications by this researcher, listed chronologically starting with the most recent first. New publications appear in this list weekly. The source of publications and 'cited by' data for this application is Scopus.
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1.
2013HoonSeok Kim; Chanyoun Won; Paul D. Franzon
Crosstalk-Canceling Multimode Interconnect\break Using Transmitter Encoding
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2013.0 -
2.
2012Peter Gadfort; Paul D. Franzon
Near threshold RF-only analog to digital converter
2012 IEEE Subthreshold Microelectronics Conference, SubVT 2012. 2012.0 -
3.
2012Joshua Ledford; Peter Gadfort; Paul D. Franzon
An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies
2012 IEEE Subthreshold Microelectronics Conference, SubVT 2012. 2012.0 -
4.
2012Gary Charles; Paul D. Franzon
Comparison of TSV-based PDN-design effects using various stacking topology methods
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012:83-86.0 -
5.
2012Zhuo Yan; Chanyoun Won; Paul D. Franzon; Kemal Aygun; Henning Braunisch
S-parameter based multimode signaling
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012:11-14.0 -
6.
2012Shivam Priyadarshi; Christopher S. Saunders; Nikhil M. Kriplani; Harun Demircioglu; W. Rhett Davis; Paul D. Franzon; Michael B. Steer
Parallel transient simulation of multiphysics circuits using delay-based partitioning
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 2012;31(10):1522-1535.0 -
7.
2012Peter Gadfort; Paul D. Franzon
Design, modeling, and fabrication of mm 3 three-dimensional integrated antennas
Proceedings - Electronic Components and Technology Conference. 2012:1794-1799.0 -
8.
2012Thorlindur Thorolfsson; Steve Lipa; Paul D. Franzon
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration
Proceedings of the Custom Integrated Circuits Conference. 2012.0 -
9.
2012Neil Di Spigna; Daniel Schinke; Srikant Jayanti; Veena Misra; Paul Franzon
A novel double floating-gate unified memory device
20th IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012 - Proceedings. 2012:53-58.0 -
10.
2012Samson Melamed; Thorlindur Thorolfsson; T. Robert Harris; Shivam Priyadarshi; Paul Franzon; Michael B. Steer; W. Rhett Davis
Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 2012;31(5):676-689.1 -
11.
2012S. Priyadarshi; T.R. Harris; S. Melamed; C. Otero; N.M. Kriplani; C.E. Christoffersen; R. Manohar; S.R. Dooley; W.R. Davis; P.D. Franzon; et al.
IET Circuits, Devices and Systems. 2012;6(1):35-44.1 -
12.
2012Yi Lou; Zhuo Yan; Fan Zhang; Paul D. Franzon
Comparing through-silicon-via (TSV) void/pinhole defect self-test methods
Journal of Electronic Testing: Theory and Applications (JETTA). 2012;28(1):27-38.1 -
13.
2012Mustafa Berke Yelten; Paul D. Franzon; Michael B. Steer
Analog negative-bias-temperature-instability monitoring circuit
IEEE Transactions on Device and Materials Reliability. 2012;12(1):177-179.0 -
14.
2012Mustafa Berke Yelten; Ting Zhu; Slawomir Koziel; Paul D. Franzon; Michael B. Steer
Demystifying surrogate modeling for circuits and systems
IEEE Circuits and Systems Magazine. 2012;12(1):45-63.1 -
15.
2012T. Robert Harris; Shivam Priyadarshi; Samson Melamed; Carlos Ortega; Rajit Manohar; Steven R. Dooley; Nikhil M. Kriplani; W. Rhett Davis; Paul D. Franzon; Michael B. Steer
A transient electrothermal analysis of three-dimensional integrated circuits
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2012;2(4):660-667.1 -
16.
2012P. Chakraborti; H.A. Karahan Toprakci; P. Yang; N. Di Spigna; P. Franzon; T. Ghosh
A compact dielectric elastomer tubular actuator for refreshable Braille displays
Sensors and Actuators, A: Physical. 2012;179:151-157.1 -
17.
2012Mustafa Berke Yelten; Paul D. Franzon; Michael B. Steer
Comparison of modeling techniques in circuit variability analysis
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 2012;25(3):288-302.1 -
18.
2012Mustafa Berke Yelten; Paul D. Franzon; Michael B. Steer
Process mismatch analysis based on reduced-order models
Proceedings - International Symposium on Quality Electronic Design, ISQED. 2012:648-655.0 -
19.
2011Ting Zhu; Michael B. Steer; Paul D. Franzon
Accurate and scalable IO buffer macromodel based on surrogate modeling
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2011;1(8):1240-1249.5 -
20.
2011T. Thorolfsson; N. Moezzi-Madani; P.D. Franzon
IET Computers and Digital Techniques. 2011;5(3):198-204.1 -
21.
2011Ting Zhu; Mustafa Berke Yelten; Michael B. Steer; Paul D. Franzon
Application of surrogate modeling in variation-aware macromodel and circuit design
SIMULTECH 2011 - Proceedings of 1st International Conference on Simulation and Modeling Methodologies, Technologies and Applications. 2011:502-508.0 -
22.
2011Mustafa Berke Yelten; Paul D. Franzon; Michael B. Steer
Surrogate-model-based analysis of analog circuits-part II: Reliability analysis
IEEE Transactions on Device and Materials Reliability. 2011;11(3):458-465.1 -
23.
2011Mustafa Berke Yelten; Paul D. Franzon; Michael B. Steer
Surrogate-model-based analysis of analog circuits-part I: Variability analysis
IEEE Transactions on Device and Materials Reliability. 2011;11(3):466-473.5 -
24.
2011Paul D. Franzon; W. Rhett Davis; Thor Thorolfsson; Samson Melamed
3D specific systems design and CAD
Proceedings - 2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation, IC-SAMOS 2011. 2011:326-329.0 -
25.
2011D. Schinke; S. Priyadarshi; W. Shepherd Pitts; N. Di Spigna; P. Franzon
SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation
IET Circuits, Devices and Systems. 2011;5(6):477-483.0 -
26.
2011Gary Charles; Paul D. Franzon; Jaemin Kim; Alex Levin
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. 2011:267-270.0 -
27.
2011Xi Chen; W. Rhett Davis; Paul D. Franzon
Adaptive clock distribution for 3D integrated circuits
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. 2011:91-94.0 -
28.
2011Paul D. Franzon; W. Rhett Davis; Thor Thorolfsson; Samson Melamed
3D specific systems: Design and CAD
Proceedings of the Asian Test Symposium. 2011:470-473.0 -
29.
2011Bruce Su; W. Shepherd Pitts; Paul D. Franzon; John Wilson
A zero power consumption multi-capacitor structure for voltage summing in high-speed FFE
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. 2011:13-16.0 -
30.
2011Daniel Schinke; Neil Di Spigna; Mihir Shiveshwarkar; Paul Franzon
Computing with novel floating-gate devices
Computer. 2011;44(2):29-36.2 -
31.
2011Paul D. Franzon; W. Rhett Davis; Zheng Zhou; Shivam Priyadarshi; Matthew Hogan; Tanay Karnik; Ganapti Srinavas
Coordinating 3D designs: Interface IP, standards or free form?
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011.0 -
32.
2011Ran Wang; Gary Charles; Paul Franzon
Modeling and compare of through-silicon-via (TSV) in high frequency
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011.0 -
33.
2011Shivam Priyadarshi; Jianchen Hu; Won Ha Choi; Samson Melamed; Xi Chen; W. Rhett Davis; Paul D. Franzon
Pathfinder 3D: A flow for system-level design space exploration
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011.0 -
34.
2010Thorlindur Thorolfsson; Guojie Luo; Jason Cong; Paul D. Franzon
Logic-on-logic 3D integration and placement
IEEE 3D System Integration Conference 2010, 3DIC 2010. 2010.0 -
35.
2010Steve Lipa; Thor Thorolfsson; Paul Franzon
IEEE 3D System Integration Conference 2010, 3DIC 2010. 2010.0 -
36.
2010Paul D. Franzon; W. Rhett Davis; Thor Thorolffson
Creating 3D specific systems: Architecture, design and CAD
Proceedings -Design, Automation and Test in Europe, DATE. 2010:1684-1688.3 -
37.
2010N. Di Spigna; P. Chakraborti; D. Winick; P. Yang; T. Ghosh; P. Franzon
The integration of novel EAP-based Braille cells for use in a refreshable tactile display
Proceedings of SPIE - The International Society for Optical Engineering. 2010;7642.3 -
38.
2010Yongjin Choi; Henning Braunisch; Kemal Aygün; Paul D. Franzon
Multimode transceiver for high-density interconnects: Measurement and validation
Proceedings - Electronic Components and Technology Conference. 2010:1733-1738.3 -
39.
2010Thorlindur Thorolfsson; Samson Melamed; W. Rhett Davis; Paul D. Franzon
Low-power hypercube divided memory FFT engine using 3D integration
ACM Transactions on Design Automation of Electronic Systems. 2010;16(1).0 -
40.
2010Samson Melamed; Thorlindur Thorolfsson; Adi Srinivasany; Edmund Chengy; Paul Franzon; W. Rhett Davis
Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs
16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010. 2010:74-79.0 -
41.
2009W. Rhett Davis; Eun Chu Oh; Ambarish M. Sule; Paul D. Franzon
Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2009;17(4):496-506.10 -
42.
2009Tao He; David A. Corley; Meng Lu; Neil Halen Di Spigna; Jianli He; David P. Nackashi; Paul D. Franzon; James M. Tour
Controllable molecular modulation of conductivity in silicon-based devices
Journal of the American Chemical Society. 2009;131(29):10023-10030.29 -
43.
2009Liang Zhang; John M. Wilson; Rizwan Bashirullah; Lei Luo; Jian Xu; Paul D. Franzon
A 32-Gb/s on-chip bus with driver pre-emphasis signaling
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2009;17(9):1267-1274.3 -
44.
2009N. Di Spigna; P. Chakraborti; P. Yang; T. Ghosh; P. Franzon
Application of EAP materials toward a refreshable Braille display
Proceedings of SPIE - The International Society for Optical Engineering. 2009;7287.9 -
45.
2009P. Kumar; H.W. Reinitz; J. Simunovic; K.P. Sandeep; P.D. Franzon
Overview of RFID technology and its applications in the food industry
Journal of Food Science. 2009;74(8):R101-R106.9 -
46.
2009Thorlindur Thorolfsson; Kiran Gonsalves; Paul D. Franzon
Design automation for a 3DIC FFT processor for synthetic aperture radar: A case study
Proceedings - Design Automation Conference. 2009:51-56.9 -
47.
2009Thorlindur Thorolfsson; Nariman Moezzi-Madani; Paul D. Franzon
A low power 3D integrated FFT engine using hypercube memory division
Proceedings of the International Symposium on Low Power Electronics and Design. 2009:231-236.1 -
48.
2009Menglin Tsai; Amy Klooz; Alexander Leonard; Jennie Appel; Paul Franzon
Through silicon via(TSV) defect/pinhole self test circuit for 3D-IC
2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009.0 -
49.
2009Thorlindur Thorolfsson; Samson Melamed; Gary Charles; Paul D. Franzon
Comparative analysis of two 3D integration implementations of a SAR processor
2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009.0 -
50.
2009Samson Melamed; Thorlindur Thorolfsson; Adi Srinivasany; Edmund Chengy; Paul Franzon; Rhett Davis
Junction-level thermal extraction and simulation of 3DICs
2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009.2 -
51.
2009Eun Chu Oh; Paul D. Franzon
Technology impact analysis for 3D TCAM
2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009.0 -
52.
2009Ting Zhu; Paul D. Franzon
An enhanced macromodeling approach for differential output drivers
BMAS 2009 - 2009 IEEE International Behavioral Modeling and Simulation Workshop. 2009:54-59.1 -
53.
2009Ting Zhu; Paul D. Franzon
Application of surrogate modeling to generate compact and PVT-sensitive IBIS models
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009:77-80.3 -
54.
2009Peter Gadfort; Paul D. Franzon
Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009:37-40.0 -
55.
2009Evan Erickson; John Wilson; Karthik Chandrasekar; Paul D. Franzon
Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009:121-124.1 -
56.
2008Chu Oh Eun; Paul D. Franzon
Design considerations and benefits of three-dimensional ternary content addressable memory
Proceedings of the Custom Integrated Circuits Conference. 2008:591-594.0 -
57.
2008Yongjin Choi; Henning Braunisch; Kemal Aygün; Paul D. Franzon
Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects
Proceedings - Electronic Components and Technology Conference. 2008:664-668.3 -
58.
2008Paul D. Franzon; W. Rhett Davis; Michael B. Steer; Steve Lipa; Eun Chu Oh; Thor Thorolfsson; Samson Melamed; Sonali Luniya; Tad Doxsee; Stephen Berkeley; et al.
Design and CAD for 3D integrated circuits
Proceedings - Design Automation Conference. 2008:668-673.11 -
59.
2008W. Rhett Davis; Ambarish M. Sule; Paul D. Franzon
An 8192-point fast fourier transform 3D-IC case study
Midwest Symposium on Circuits and Systems. 2008:438-441.1 -
60.
2008Yuan Xie; Jason Cong; Paul Franzon
Editorial: Special issue on 3D integrated circuits and microarchitectures
ACM Journal on Emerging Technologies in Computing Systems. 2008;4(4).0 -
61.
2008Tao He; Meng Lu; Jun Yao; Jianli He; Bo Chen; Neil Halen Di Spigna; David P. Nackashi; Paul D. Franzon; James M. Tour
Reversible modulation of conductance in silicon devices via UV/visible-light irradiation
Advanced Materials. 2008;20(23):4541-4546.3 -
62.
2008Flavio Canavero; Paul D. Franzon
IEEE Transactions on Advanced Packaging. 2008;31(4):662-663.0 -
63.
2008Karthik Chandrasekar; John Wilson; Evan Erickson; Zhiping Feng; Jian Xu; Stephen Mick; Paul Franzon
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging. 2008;31(4):749-758.3 -
64.
2008Ambrish K. Varma; Michael Steer; Paul D. Franzon
Improving behavioral IO buffer modeling based on IBIS
IEEE Transactions on Advanced Packaging. 2008;31(4):711-721.12 -
65.
2008Bruce Su; Pravin Patel; Steve W. Hunter; Moises Cases; Paul D. Franzon
AC coupled backplane communication using embedded capacitor
Electrical Performance of Electronic Packaging, EPEP. 2008:295-298.2 -
66.
2008Yongjin Choi; Chanyoun Won; Paul D. Franzon; Henning Braunisch; Kemal Aygtün
Multimode signaling on non-ideal channels
Electrical Performance of Electronic Packaging, EPEP. 2008:51-54.2 -
67.
2008Paul D. Franzon; Steven Lipa; Julie Oh; Thor Thorolfsson; Rhett Davis
Memory rich applications for 3D integration
Proceedings of SPIE - The International Society for Optical Engineering. 2008;7268.0 -
68.
2007Dhruba Chandra; Ullas Pazhayaveetil; Paul D. Franzon
Architecture for low power large vocabulary speech recognition
2006 IEEE International Systems-on-Chip Conference, SOC. 2007:25-28.0 -
69.
2007J.M. Wilson; C.R. Merritt; B. Karaguzel; T. Kang; H.T. Nagle; E. Grant; B. Pourdeyhemi; P.D. Franzon
High-frequency characterization of printed CPW lines on textiles using a custom test fixture
Proceedings - 10th IEEE Workshop on Signal Propagation on Interconnects, SPI 2006. 2007:279-280.0 -
70.
2007J.M. Wilson; S.E. Mick; J. Xu; L. Luo; E.L. Erickson; P.D. Franzon
Proceedings - 10th IEEE Workshop on Signal Propagation on Interconnects, SPI 2006. 2007:281-282.0 -
71.
2007Paul D. Franzon; William Rhett Davis; Michael B. Steer; Hua Hao; Steven Lipa; Sonali Luniya; Christopher Mineo; Julie Oh; Ambirish Sule; Thor Thorolfsson
Design for 3D integration and applications
Conference Proceedings of the International Symposium on Signals, Systems and Electronics. 2007:263-266.6 -
72.
2007Paul Franzon; Michael Lambert
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2007:iii.0 -
73.
2007Ambrish Varma; Michael Steer; Paul Franzon
System level validation of improved IO buffer behavioral modeling methodology based on IBIS
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2007:351-356.0 -
74.
2007Thorlindur Thorolfsson; Paul D. Franzon
System design for 3D multi-FPGA packaging
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2007:171-174.0 -
75.
2007Paul D. Franzon
Proceedings of the 2nd IEEE International Workshop on Advances in Sensors and Interfaces, IWASI. 2007.0 -
76.
2007Mehmet Rasit Yuce; Wentai Liu; John Damiano; Bhaskar Bharath; Paul D. Franzon; Numan S. Dogan
SOI CMOS implementation of a multirate PSK demodulator for space communications
IEEE Transactions on Circuits and Systems I: Regular Papers. 2007;54(2):420-431.2 -
77.
2007Liang Zhang; John M. Wilson; Rizwan Bashirullah; Lei Luo; Jian Xu; Paul D. Franzon
Voltage-mode driver preemphasis technique for on-chip global buses
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2007;15(2):231-236.2 -
78.
2007Eun Chu Oh; Paul D. Franzon
TCAM core design in 3D IC for low matchline capacitance and low power
Proceedings of SPIE - The International Society for Optical Engineering. 2007;6414.0 -
79.
2007Sachin R. Sonkusale; Neil H. Di Spigna; Paul D. Franzon
Microelectronic Engineering. 2007;84(5-8):1523-1527.2 -
80.
2007John Wilson; Stephen Mick; Jian Xu; Lei Luo; Salvatore Bonafede; Alan Huffman; Richard LaBennett; Paul D. Franzon
Fully integrated AC coupled interconnect using buried bumps
IEEE Transactions on Advanced Packaging. 2007;30(2):191-199.3 -
81.
2007Paul Franzon; David Nackashi; Christian Amsinck; Neil Dispigna; Sachin Sonkusale
Molecular electronics - Devices and circuits technology
IFIP International Federation for Information Processing. 2007;240:1-10.2 -
82.
2007James E. Stine; Ivan Castellanos; Michael Wood; Jeff Henson; Fred Love; W. Rhett Davis; Paul D. Franzon; Michael Bûcher; Sunil Basavarajaiah; Julie Oh; et al.
FreePDK: An open-source variation-aware design kit
Proceedings - MSE 2007: 2007 IEEE International Conference on Microelectronic Systems Education: Educating Systems Designers for the Global Economy and a Secure World. 2007:173-174.23 -
83.
2007Meeta Yadav; Ashwini Venkatachaliah; Paul D. Franzon
Hardware architecture of a parallel pattern matching engine
Proceedings - IEEE International Symposium on Circuits and Systems. 2007:1369-1372.2 -
84.
2007Ullas Pazhayaveetil; Dhruba Chandra; Paul Franzon
Flexible low power probability density estimation unit for speech recognition
Proceedings - IEEE International Symposium on Circuits and Systems. 2007:1117-1120.6 -
85.
2007Amy Szuchmacher Blum; Carissa M. Soto; Charmaine D. Wilson; Christian Amsinck; Paul Franzon; Banahalli R. Ratna
Electronic properties of molecular memory circuits on a nanoscale scaffold
IEEE Transactions on Nanobioscience. 2007;6(4):270-274.7 -
86.
2007Karthik Chandrasekar; John Wilson; Evan Erickson; Zhiping Feng; Jian Xu; Stephen Mick; Paul Franzon
Signal integrity analysis for inductively coupled connectors and sockets
International Engineering Consortium - DesignCon 2007. 2007;3:1519-1539.0 -
87.
2006Liang Zhang; John Wilson; Rizwan Bashirullah; Lei Luo; Jian Xu; Paul Franzon
A 32Gb/s on-chip bus with driver pre-emphasis signaling
Proceedings of the Custom Integrated Circuits Conference. 2006:265-268.6 -
88.
2006Tae-Ho Kang; Carey Merritt; Burcak Karaguzel; John Wilson; Paul Franzon; Behnam Pourdeyhimi; Edward Grant; Troy Nagle
Sensors on textile substrates for home-based healthcare monitoring
Conference Proceedings - 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare, D2H2 2006. 2006;2006:5-7.1 -
89.
2006Tao He; Jianli He; Meng Lu; Bo Chen; Harry Pang; William F. Reus; Whitney M. Nolte; David P. Nackashi; Paul D. Franzon; James M. Tour
Controlled modulation of conductance in silicon devices by molecular monolayers
Journal of the American Chemical Society. 2006;128(45):14537-14541.68 -
90.
2006John Wilson; Lei Luo; Jian Xu; Stephen Mick; Evan Erickson; Hsuan-Jung Su; Benson Chan; How Lin; Paul Franzon
AC coupled interconnect using buried bumps for laminated organic packages
Proceedings - Electronic Components and Technology Conference. 2006;2006:41-48.0 -
91.
2006Lei Luo; John Wilson; Stephen Mick; Jian Xu; Liang Zhang; Evan Erickson; Paul Franzon
A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver
Proceedings of the Custom Integrated Circuits Conference. 2006:773-776.4 -
92.
2006Ambrish Varma; Michael Steer; Paul Franzon
Developing improved IO buffer behavioral modeling methodology based on IBIS
Electrical Performance of Electronic Packaging, EPEP. 2006:69-72.0 -
93.
2006Karthik Chandrasekar; John Wilson; Evan Erickson; Zhiping Feng; Jian Xu; Stephen Mick; Paul Franzon
Fine pitch inductively coupled connectors for multi-gbps pulse signaling
Electrical Performance of Electronic Packaging, EPEP. 2006:11-14.1 -
94.
2006Sachin Sonkusale; Paul Franzon
Controlled nanowire fabrication by PEDAL process
2006 1st International Conference on Nano-Networks and Workshops, Nano-Net. 2006.0 -
95.
2006L. Luo; J.M. Wilson; S.E. Mick; Jian Xu; Liang Zhang; P.D. Franzon
3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver
IEEE Journal of Solid-State Circuits. 2006;41(1):287-296.32 -
96.
2006Nikhil M. Kriplani; David P. Nackashi; Christian J. Amsinck; Neil H. Di Spigna; Michael B. Steer; Paul D. Franzon; Ramon L. Rick; Gemma C. Solomon; Jeffrey R. Reimers
Physically based molecular device model in a transient circuit simulator
Chemical Physics. 2006;326(1):188-196.2 -
97.
2006Neil H. Di Spigna; David P. Nackashi; Christian J. Amsinck; Sachin R. Sonkusale; Paul D. Franzon
Deterministic nanowire fanout and interconnect without any critical translational alignment
IEEE Transactions on Nanotechnology. 2006;5(4):356-361.3 -
98.
2005David P. Nackashi; Christian J. Amsinck; Neil H. Dispigna; Paul D. Franzon
Molecular electronic latches and memories
2005 5th IEEE Conference on Nanotechnology. 2005;2:89-92.1 -
99.
2005Jayesh Nath; Dipankar Ghosh; Wael Fathelbab; Jon-Paul Maria; Angus I. Kingon; Paul D. Franzon; Michael B. Steer
IEEE MTT-S International Microwave Symposium Digest. 2005;2005:595-598.9 -
100.
2005Jian Xu; Edward Grant; Angus I. Kingon; John M. Wilson; Paul D. Franzon
Drive circuit for a mode conversion rotary ultrasonic motor
IECON Proceedings (Industrial Electronics Conference). 2005;2005:1588-1592.0 -
101.
2005Numan S. Dogan; Paul Franzon; Wentai Liu
Impact of an SoC research project on microelectronics education: A case study
Proceedings - 2005 IEEE International Conference on Microelectronic Systems Education, MSE '05 - Promoting Excellence and Innovation in Microelectronic Systems Education. 2005;2005:33-34.1 -
102.
2005Sachin R. Sonkusale; Christian J. Amsinck; David P. Nackashi; Neil H. Di Spigna; Doug Barlage; Mark Johnson; Paul D. Franzon
Wafer scale aligned sub-25nm metal nanowires on Silicon (110) using PEDAL lift-off process
2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings. 2005:255-258.1 -
103.
2005Amy Szuchmacher Blum; Carissa M. Soto; Charmaine D. Wilson; Tina L. Brower; Steven K. Pollack; Terence L. Schull; Anju Chatterji; Tianwei Lin; John E. Johnson; et al.
An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale
Small. 2005;1(7):702-706.57 -
104.
2005Jian Xu; John Wilson; Stephen Mick; Lei Luo; Paul Franzon
2.8Gb/s inductively coupled interconnect for 3-D ICs
IEEE Symposium on VLSI Circuits, Digest of Technical Papers. 2005;2005:352-355.11 -
105.
2005Lei Luo; John M. Wilson; Stephen E. Mick; Jian Xu; Liang Zhang; Paul D. Franzon
3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver
Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2005;48:434-435+721.0 -
106.
2005W. Rhett Davis; John Wilson; Stephen Mick; Jian Xu; Hao Hua; Christopher Mineo; Ambarish M. Sule; Michael Steer; Paul D. Franzon
Demystifying 3D ICs: The pros and cons of going vertical
IEEE Design and Test of Computers. 2005;22(6):498-510.263 -
107.
2005John M. Wilson; Rizwan Bashirullah; David P. Nackashi; David A. Winick; Paul D. Franzon
Proceedings of SPIE - The International Society for Optical Engineering. 2005;5836:138-152.1 -
108.
2005Liang Zhang; John Wilson; Rizwan Bashirullah; Lei Luo; Jian Xu; Paul Franzon
Driver pre-emphasis techniques for on-chip global buses
Proceedings of the International Symposium on Low Power Electronics and Design. 2005:186-191.7 -
109.
2005Ambrish K. Varma; Alan Glaser; Paul D. Franzon
CAD flows for chip-package coverification
IEEE Transactions on Advanced Packaging. 2005;28(1):96-101.1 -
110.
2005Sachin R. Sonkusale; Christian J. Amsinck; David P. Nackashi; Neil H. Di Spigna; Doug Barlage; Mark Johnson; Paul D. Franzon
Physica E: Low-Dimensional Systems and Nanostructures. 2005;28(2):107-114.14 -
111.
2005Taeyun Kim; Jayesh Nath; John Wilson; Stephen Mick; Paul D. Franzon; Michael B. Steer; Angus I. Kingon
A high K nanocomposite for high density chip-to-package interconnections
Materials Research Society Symposium Proceedings. 2005;833:201-206.4 -
112.
2005Pronita Mehrotra; Vikram Rao; Thomas M. Conte; Paul D. Franzon
Optimal chip-package codesign for high-performance DSP
IEEE Transactions on Advanced Packaging. 2005;28(2):288-297.3 -
113.
2005Karthik Chandrasekar; Zhiping Feng; John Wilson; Stephen Mick; Paul Franzon
Inductively coupled board-to-board connectors
Proceedings - Electronic Components and Technology Conference. 2005;2:1109-1113.5 -
114.
2005Christian J. Amsinck; Neil H. Di Spigna; David P. Nackashi; Paul D. Franzon
Scaling constraints in nanoelectronic random-access memories
Nanotechnology. 2005;16(10):2251-2260.33 -
115.
2005Jayesh Nath; Dipankar Ghosh; Jon-Paul Maria; Angus I. Kingon; Wael Fathelbab; Paul D. Franzon; Michael B. Steer
IEEE Transactions on Microwave Theory and Techniques. 2005;53(9):2707-2712.105 -
116.
2005Lei Luo; John M. Wilson; Stephen E. Mick; Jian Xu; Liang Zhang; Paul D. Franzon
3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver
Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2005;48:522-523+614.20 -
117.
2005Carey R. Merritt; Burcak Karaguzel; Tae-Ho Kang; John M. Wilson; Paul D. Franzon; H. Troy Nagle; Behnam Pourdeyhimi; Edward Grant
Electrical characterization of transmission lines on nonwoven textile substrates
Materials Research Society Symposium Proceedings. 2005;870:87-95.4 -
118.
2005John Wilson; Stephen Mick; Jian Xu; Lei Luo; Salvatore Bonafede; Alan Huffman; Richard LaBennett; Paul Franzon
Fully integrated AC coupled interconnect using buried bumps
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2005;2005:7-10.7 -
119.
2005Ambrish Varma; Michael Steer; Paul Franzon
A new method to achieve improved accuracy with IBIS models
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2005;2005:119-122.3 -
120.
2005Lei Luo; John Wilson; Jian Xu; Stephen Mick; Paul Franzon
Signal integrity and robustness of ACCI packaged systems
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2005;2005:11-14.1 -
121.
2005Liang Zhang; John Wilson; Rizwan Bashirullah; Paul Franzon
Differential current-mode signaling for robust and power efficient on-chip global interconnects
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2005;2005:315-318.4 -
122.
2004Ambrish Varma; Michael Steer; Paul Franzon
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2004:87-90.9 -
123.
2004J. Damiano; P.D. Franzon
Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance / low power
Proceedings - IEEE International SOI Conference. 2004:115-116.3 -
124.
2004Mehmet R. Yuce; Wentai Liu; Bhaskar Bharat; John Damiano; Paul D. Franzon
Proceedings of the Custom Integrated Circuits Conference. 2004:591-594.3 -
125.
2004J.A. Palmer; J.F. Mulling; B. Dessent; E. Grant; J.W. Eischen; A. Gruverman; A.I. Kingon; P.D. Franzon
Proceedings - IEEE International Conference on Robotics and Automation. 2004;2004(5):4668-4674.0 -
126.
2004Jeremy A. Palmer; Brian Dessent; James F. Mulling; Tim Usher; Edward Grant; Jeffrey W. Eischen; Angus I. Kingon; Paul D. Franzon
The design and characterization of a novel piezoelectric transducer-based linear motor
IEEE/ASME Transactions on Mechatronics. 2004;9(2):392-398.7 -
127.
2004Ramya Mohan; Myoung Joon Choi; Stephen E. Mick; Frank P. Hart; Karthik Chandrasekar; Andreas C. Cangellaris; Paul D. Franzon; Michael B. Steer
Causal reduced-order modeling of distributed structures in a transient circuit simulator
IEEE Transactions on Microwave Theory and Techniques. 2004;52(9 II):2207-2214.8 -
128.
2004Michael Scheffler; Paul D. Franzon; Gerhard Tröster
A "defect level versus cost" system tradeoff for electronics manufacturing
IEEE Transactions on Electronics Packaging Manufacturing. 2004;27(1):67-76.2 -
129.
2004Ambrish Varma; Steve Lipa; Alan Glaser; Michael Steer; Paul Franzon
Simultaneous switching noise in IBIS models
IEEE International Symposium on Electromagnetic Compatibility. 2004;3:1000-1004.9 -
130.
2004C. Amsinck; N. Di Spigna; D. Nackashi; P. Franzon
2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. 2004;3:61-64.0 -
131.
2004David P. Nackashi; Neil H. Di Spigna; David A. Winick; Christian J. Amsinck; Long Cheng; James M. Tour; Paul D. Franzon
Discontinuous gold films for nanocell memories
2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. 2004;3:45-48.3 -
132.
2004Jorge M. Seminario; Yuefei Ma; Luis A. Agapito; Liuming Yan; Roy A. Araujo; Sridhar Bingi; Nagendra S. Vadlamani; Krishna Chagarlamudi; Tangali S. Sudarshan; Michael L. Myrick; et al.
Clustering effects on discontinuous gold film NanoCells
Journal of Nanoscience and Nanotechnology. 2004;4(7):907-917.26 -
133.
2004Jian Xu; Stephen Mick; John Wilson; Lei Luo; Karthik Chandrasekar; Evan Erickson; Paul D. Franzon
AC coupled interconnect for dense 3-D ICs
IEEE Transactions on Nuclear Science. 2004;51(5 I):2156-2160.15 -
134.
2004Toby Schaffer; Alan Glaser; Paul D. Franzon
Chip-package co-implementation of a triple DES processor
IEEE Transactions on Advanced Packaging. 2004;27(1):194-202.4 -
135.
2004Paul Franzon; Stephen Mick; John Wilson; Lei Luo; Karthik Chandrasakhar
AC Coupled Interconnect for high-density high-bandwidth packaging
Proceedings of SPIE - The International Society for Optical Engineering. 2004;5274:67-69.0 -
136.
2004Stephen Mick; Lei Luo; John Wilson; Paul Franzon
Buried bump and AC coupled interconnection technology
IEEE Transactions on Advanced Packaging. 2004;27(1):121-125.11 -
137.
2004Liang Zhang; Wentai Liu; Rizwan Bashirullah; John Wilson; Paul Franzon
Simplified delay design guidelines for on-chip global interconnects
Proceedings of the ACM Great Lakes Symposium on VLSI. 2004:29-32.2 -
138.
2003Paul Franzon; Angus Kingon; Stephen Mick; John Wilson; Lei Luo; Karthik Chandrasakhar; Jian Xu; Salvatore Bonafede; Alan Huffman; Chad Statler; et al.
High frequency, high density interconnect using AC coupling
Materials Research Society Symposium - Proceedings. 2003;783:165-169.0 -
139.
2003Jian Xu; Stephen Mick; John Wilson; Lei Luo; Karthik Chandrasekar; Evan Erickson; Paul D. Franzon
AC coupled interconnect for dense 3-D ICs
IEEE Nuclear Science Symposium Conference Record. 2003;1:125-129.1 -
140.
2003Mircea R. Stan; Paul D. Franzon; Seth Copen Goldstein; John C. Lach; Matthew M. Ziegler
Molecular electronics: From devices and interconnect to circuits and architecture
Proceedings of the IEEE. 2003;91(11):1940-1957.167 -
141.
2003James M. Tour; Long Cheng; David P. Nackashi; Yuxing Yao; Austen K. Flatt; Sarah K. St. Angelo; Thomas E. Mallouk; Paul D. Franzon
Journal of the American Chemical Society. 2003;125(43):13279-13283.74 -
142.
2003Mehmet R. Yuce; Wentai Liu; John Damiano; Bhaskar Bharat; Paul D. Franzon; Numan S. Dogan
A low power PSK receiver for space applications in 0.35-μm SOI CMOS
Proceedings of the Custom Integrated Circuits Conference. 2003:155-158.0 -
143.
2002Stephen Mick; John Wilson; Paul Franzon
4 Gbps high-density AC coupled interconnection
Proceedings of the Custom Integrated Circuits Conference. 2002:133-140.48 -
144.
2002Pronita Mehrotra; Paul D. Franzon
Novel hardware architecture for fast address lookups
IEEE Communications Magazine. 2002;40(11):66-71.6 -
145.
2002Pronita Mehrotra; Paul D. Franzon
Binary search schemes for fast IP lookups
Conference Record / IEEE Global Telecommunications Conference. 2002;2:2005-2009.1 -
146.
2002James M. Tour; William L. Van Zandt; Christopher P Husband; Summer M. Husband; Lauren S. Wilson; Paul D. Franzon; David P Nackashi
Nanocell logic gates for molecular computing
IEEE Transactions on Nanotechnology. 2002;1(2):100-108.79 -
147.
2001P. Mehrotra; I. Baldine; D. Stevenson; P. Franzon
Network processor design for optical burst switched networks
Proceedings of the Annual IEEE International ASIC Conference and Exhibit. 2001:296-300.5 -
148.
2001D.P. Nackashi; P.D. Franzon
Molectronics: A circuit design perspective
Proceedings of SPIE - The International Society for Optical Engineering. 2001;4236:80-88.2 -
149.
2001J. Wood; S. Lipa; P. Franzon; M. Steer
Multi-gigaHertz low-power low-skew rotary clock scheme
Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2001:400-401+470.7 -
150.
2001Paul D. Franzon
Proceeding of SPIE - The International Society for Optical Engineering: Introduction
Proceedings of SPIE - The International Society for Optical Engineering. 2001;4593:ix.0 -
151.
2001Bruce Duewer; David Winick; Andrew E. Oberhofer; John Muth; Paul D. Franzon
Improving interconnect characteristics of thin film MEMS processes
Proceedings of SPIE - The International Society for Optical Engineering. 2001;4592:196-204.0 -
152.
2001John Wilson; Rizwan Bashirullah; David Nackashi; David Winick; Bruce Duewer; Paul D. Franzon
Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies
Proceedings of SPIE - The International Society for Optical Engineering. 2001;4593:186-197.1 -
153.
2001James Mulling; Tim Usher; Brian Dessent; Jeremy Palmer; Paul Franzon; Eddie Grant; Angus Kingon
Load characterization of high displacement piezoelectric actuators with various end conditions
Sensors and Actuators, A: Physical. 2001;94(1-2):19-24.46 -
154.
2000S. Gahide; G.L. Hodge; W. Oxenham; A.M. Seyam; P.D. Franzon
Micromachines and textiles; matching two industries
Textile Asia. 2000;31(8):58-66.1 -
155.
2000S. Gahide; G.L. Hodge; W. Oxenham; A.M. Seyam; P.D. Franzon
Micromachines and textiles: Matching two industries
Proceedings of the 80th World Conference of the Textile Institute, Manchester, April 16 - 19, 2000. 2000:1.0 -
156.
2000James Mulling; Tim Usher; Brian Dessent; Jeremy Palmer; Paul Franzon; Eddie Grant; Angus Kingon
IEEE International Symposium on Applications of Ferroelectrics. 2000;2:745-748.1 -
157.
2000Pronita Mehrotra; Vikram Rao; Tom Conte; Paul Franzon
Leveraging high density packaging for high performance DSP systems
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 2000:25-28.0 -
158.
1999Real G. Pomerleau; Paul D. Franzon; Griff L. Bilbro
Improved delay prediction for on-chip buses
Proceedings - Design Automation Conference. 1999:497-501.2 -
159.
1999Bruce Duewer; David Winick; John Wilson; Jeremy Palmer; Paul Franzon
Methodology for design of electrostatic MEMS devices using the SUMMiT process
Instrumentation in the Aerospace Industry : Proceedings of the International Symposium. 1999:507-516.0 -
160.
1999B.E. Duewer; J.M. Wilson; D.A. Winick; P.D. Franzon
Programmable MEMS capacitor arrays
Proceedings of SPIE - The International Society for Optical Engineering. 1999;3893:262-271.2 -
161.
1999Mouna Nakkar; Alan Glaser; Paul Franzon; C.Kenneth Williams; Mark Roberson; Glenn Rinne
Three dimensional high density MCM package assembly and analysis
Proceedings of SPIE - The International Society for Optical Engineering. 1999;3830:188-193.1 -
162.
1999H. Louis Lo; J. Frank Kauffman; Paul D. Franzon
High frequency loss and electromagnetic field distribution for striplines and microstrips
IEEE Transactions on Advanced Packaging. 1999;22(1):16-25.4 -
163.
1998Hong-Yean Hsieh; Wentai Liu; Mark Clements; Paul Franzon
Self-calibrating clock distribution with scheduled skews
Proceedings - IEEE International Symposium on Circuits and Systems. 1998;2:470-473.3 -
164.
1998Said F. Al-sarawi; Derek Abbott; Paul D. Franzon
A review of 3-D packaging technology
IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 1998;21(1):2-14.174 -
165.
1998David Winick; Bruce Duewer; Som Chaudhury; John Wilson; John Tucker; Umut Eksi; Paul Franzon
MEMS-based diffractive optical beam steering technology
Proceedings of SPIE - The International Society for Optical Engineering. 1998;3276:81-87.3 -
166.
1998S. Lipa; J.T. Schaffer; A.W. Glaser; P.D. Franzon
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1998:39-41.0 -
167.
1998Mouna Nakkar; John Harding; David Schwartz; Paul Franzon; Thomas Conte
Dynamically programmable cache
Proceedings of SPIE - The International Society for Optical Engineering. 1998;3526:218-226.0 -
168.
1997David A. Winick; Bruce E. Duewer; S. Palchaudhury; Paul D. Franzon
Performance evaluation of micromechanical binary phase-only holographic optical elements
Proceedings - Electronic Components and Technology Conference. 1997:419-424.2 -
169.
1997Kenneth J. McClellan Jr.; Tom S. Wailes; Paul D. Franzon
Accurate, computationally efficient crosstalk model for routing high-speed MCMs
Proceedings of the Annual IEEE International ASIC Conference and Exhibit. 1997:110-114.0 -
170.
1997Mir Azam; Paul Franzon; Wentai Liu
Low power data processing by elimination of redundant computations
International Symposium on Low Power Electronics and Design, Digest of Technical Papers. 1997:259-264.7 -
171.
1997Alan Glaser; Mouna Nakkar; Paul Franzon; Glenn Rinne; Mark Roberson; Vince Rogers; C.Kenneth Williams
Low cost, high performance three-dimensional memory module technology
Records of the IEEE International Workshop on Memory Technology, Design and Testing. 1997:2-7.0 -
172.
1997Wes Hansford; Jennifer Peltier; Paul Franzon; Steve Lipa; Jonathon Schaeffer
Prototype development of flip chip MCMs
Proceedings of the IEEE Multi-Chip Module Conference. 1997.0 -
173.
1997Toby Schaffer; Alan Glaser; Srisai Rao; Paul Franzon
Flip-chip implementation of the data encryption standard (DES)
Proceedings of the IEEE Multi-Chip Module Conference. 1997.0 -
174.
1997Hong-Yean Hsieh; Wentai Liu; Paul Franzon; Ralph Cavin III
Clocking Optimization and Distribution in Digital Systems with Scheduled Skews
Journal of VLSI Signal Processing Systems for Signal, Image, and Video Technology. 1997;16(2-3):131-147.0 -
175.
1997Baribrata Biswas; Allen Glasser; Steven Lipa; Michael Steer; Paul Franzon; Dieter Griffis; Phillip Russell
Experimental electrical characterization of on-chip interconnects
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1997:57-59.2 -
176.
1997Kenneth J. McClellan Jr.; Tom S. Wailes; Paul D. Franzon
Simulation vs calculation of crosstalk
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1997:131-134.2 -
177.
1997D. Abbott; S.F. Al-sarawi; P. Franzon
3D packaging technology for portable systems
Proceedings of the Australian Microelectronics Conference. 1997:221-226.1 -
178.
1996Christoforos Harvatis; Yusuf C. Tekmen; Griff L. Bilbro; Paul D. Franzon
Pin assignment for high-performance MCM systems
Proceedings - IEEE International Symposium on Circuits and Systems. 1996;4:771-774.0 -
179.
1996Paul D. Franzon; Tom Conte; Sanjeev Banerjia; Scott Alvorez; Alan Glaser; Steve Lipa; Toby Schaffer; Andrew Stanaski; Yusuf Tekmen
Computer design strategy for MCM-D/flip-chip technology
Proceedings of the Annual IEEE International ASIC Conference and Exhibit. 1996:35-39.1 -
180.
1996Sanjeev Banerjia; Alan Glaser; Christoforos Harvatis; Steve Lipa; Real Pomerleau; Toby Schaffer; Andrew Stanaski; Yusuf Tekmen; Grif Bilbro; et al.
Issues in partitioning integrated circuits for MCM-D/flip-chip technology
Proceedings of the IEEE Multi-Chip Module Conference. 1996:154-159.2 -
181.
1996Steven Lipa; Michael B. Steer; Andreas C. Cangellaris; Paul D. Franzon
Experimental characterization of transmission lines in thin-film multichip modules
IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 1996;19(1):122-125.1 -
182.
1996Raj Lakhani; Craig Deutschle; Paul Franzon; Michael Steer
High speed bus design using HSPICE optimization techniques based on the worst case design approach
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1996:93-96.1 -
183.
1996Paul D. Franzon; Tom Conte; Sanjeev Banerjia; Alan Glaser; Steve Lipa; Toby Schaffer; Andrew Stanaski; Yusuf Tekmen
Computer design strategy for MCM-D/flip-chip technology
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1996:6-8.1 -
184.
1995David Salzman; Thomas Knight Jr.; Paul Franzon
Application of capacitive coupling to switch fabrics
Proceedings of the IEEE Multi-Chip Module Conference. 1995:195-199.2 -
185.
1995David A. Winick; W.Michael Teague; Paul D. Franzon
Micro-machined approach to optical interconnect
Proceedings - Electronic Components and Technology Conference. 1995:780-785.2 -
186.
1995Paul D. Franzon; Andrew Stanaski; Yusuf Tekmen; Sanjeev Banerjai
System design optimization for MCM
Proceedings of the IEEE Multi-Chip Module Conference. 1995:138-143.0 -
187.
1995Sharad Mehrotra; Paul Franzon; Michael Steer
Performance driven global routing and wiring rule generation for high speed PCBs and MCMs
Proceedings - Design Automation Conference. 1995:381-387.0 -
188.
1995Mark S. Basel; Michael B. Steer; Paul D. Franzon
Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1995;18(1):74-82.7 -
189.
1995Robert J. Evans; Paul D. Franzon
Energy consumption modeling and optimization for SRAM's
IEEE Journal of Solid-State Circuits. 1995;30(5):571-579.37 -
190.
1995Paul D. Franzon; Andrew Stanaski; Yusuf Tekmen; Sanjeev Banerjia
System design optimization for MCM-D/flip-chip
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1995;18(4):620-627.1 -
191.
1995A.W. Glaser; M.B. Steer; G.M. Shedd; P.E. Russell; P.D. Franzon
Method for on-chip interconnect characterization
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1995:108-110.0 -
192.
1994Maitreya Sengupta; Steve Lipa; Paul Franzon; Michael Steer
Crosstalk driven routing advice
Proceedings - Electronic Components and Technology Conference. 1994:687-694.2 -
193.
1994Mark S. Basel; Michael B. Steer; Paul D. Franzon
Hierarchical simulation of high speed digital interconnects using a packaging simulator
Proceedings - Electronic Components and Technology Conference. 1994:81-87.0 -
194.
1994Sharad Mehrotra; Paul Franzon; Wentai Liu
Skew and delay minimization of high speed CMOS circuits using stochastic optimization
Proceedings of the Custom Integrated Circuits Conference. 1994:245-248.0 -
195.
1994Slobodan Simovich; Sharad Mehrotra; Paul Franzon; Michael Steer
Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1994;17(1):15-21.1 -
196.
1994Sha Ma; Paul Franzon
Energy control and accurate delay estimation in the design of CMOS buffer
IEEE Journal of Solid-State Circuits. 1994;29(9):1150-1153.10 -
197.
1994Sharad Mehrotra; Paul Franzon; Wentai Liu
Stochastic optimization approach to transistor sizing for CMOS VLSI circuits
Proceedings - Design Automation Conference. 1994:36-40.1 -
198.
1994Sharad Mehrotra; Paul Franzon; Griff Bilbro; Michael Steer
CAD tools for managing signal integrity and congestion simultaneously
IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1994:30-32.0 -
199.
1993Paul Franzon; Slobodan Simovich; Sharad Mehrotra; Michael Steer
Automatic A-priori generation of delay and noise macromodels and wiring rules for MCMs
Proceedings 1993 IEEE Multi-Chip Module Conference. 1993:185-190.0 -
200.
1993Paul Franzon; Slobodan Simovich; Sharad Mehrotra; Michael Steer
Macromodels for generating signal integrity and timing management advice for package design
Proceedings - Electronic Components and Technology Conference. 1993:523-529.1 -
201.
1993Alexander R. Dalal; Paul D. Franzon; Michael J. Lorenzetti
Layout-driven yield predictor and fault generator for VLSI
IEEE Transactions on Semiconductor Manufacturing. 1993;6(1):77-82.8 -
202.
1993S. Simovich; P.D. Franzon; M.B. Steer
Method for automated waveform analysis of transient responses in digital circuits
Electronics Letters. 1993;29(8):681-682.0 -
203.
1993Steven Lipa; Michael B. Steer; Arthur S. Morris; Paul D. Franzon
IEEE transactions on components, hybrids, and manufacturing technology. 1993;16(3):247-252.3 -
204.
1993Todd A. Cook; Paul D. Franzon; Ed A. Harcourt; Thomas K. Miller III
System-level specification of instruction sets
Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. 1993:552-557.0 -
205.
1992Michael B. Steer; Steven B. Goldberg; Paul D. Franzon
IEEE Transactions on Microwave Theory and Techniques. 1992;40(2):410-411.2 -
206.
1992Paul Franzon; Simovich Slobodan; Michael Steer; Mark Basel; Sharad Mehrotra; Tom Mills
Tools to aid in wiring rule generation for high speed interconnects
Proceedings - Design Automation Conference. 1992:466-471.1 -
207.
1992Michael B. Steer; Steven B. Goldberg; Glenn Rinne; Paul D. Franzon; Iwona Turlik; Jeff S. Kasten
Introducing the through-line deembedding procedure
IEEE MTT-S International Microwave Symposium Digest. 1992;3:1455-1458.20 -
208.
1991Steven B. Goldberg; Michael B. Steer; Paul D. Franzon; Jeffery S. Kasten
Experimental electrical characterization of high speed interconnects
Proceedings - Electronic Components Conference. 1991:85-88.0 -
209.
1991Mark S. Basel; Michael B. Steer; Paul D. Franzon; Dan Winkelstein
High speed digital system simulation using frequency dependent transmission line network modeling
IEEE MTT-S International Microwave Symposium Digest. 1991;3:987-990.0 -
210.
1991Steven B. Goldberg; Michael B. Steer; Paul D. Franzon; Jeffrey S. Kasten
IEEE transactions on components, hybrids, and manufacturing technology. 1991;14(4):761-765.5 -
211.
1991Steven B. Goldberg; Michael B. Steer; Paul D. Franzon
Accurate experimental characterization of three-ports
IEEE MTT-S International Microwave Symposium Digest. 1991;1:241-244.6 -
212.
1990Paul Franzon; David Van den Bout; John Paulos; Thomas Miller; Wesley Snyder; Troy Nagle; Wentai Liu
Defect tolerant implementations of feed-forward and recurrent neural networks
1990:160-166.0 -
213.
1990D. van den Bout; P. Franzon; J. Paulos; T. Miller; W. Snyder; T. Nagle; W. Liu
Scalable VLSI implementations for neural networks
Journal of VLSI Signal Processing. 1990;1(4):367-385.0 -
214.
1989P.D. Franzon
Modelling interconnect yield in reconfigurable circuits
Electronics Letters. 1989;25(18):1225-1226.0 -
215.
1987Mehdi Hatamian; Lawrence A. Hornak; Trevor E. Little; Stuart K. Tewksbury; Paul Franzon
FUNDAMENTAL INTERCONNECTION ISSUES.
AT&T Technical Journal. 1987;66(4):13-30.5 -
216.
1987S.K. Tewksbury; M. Hatamian; P. Franzon; L.A. Hornak; C.A. Siller Jr.; V.B. Lawrence
FIR DIGITAL FILTERS FOR HIGH SAMPLE RATE APPLICATIONS.
IEEE Communications Magazine. 1987;25(7):62-72.2 -
217.
19860 -
218.
1986L.A. Hornak; S.K. Tewksbury; M. Hatamian; A. Ligtenberg; B. Sugla; P. Franzon
THROUGH-WAFER OPTICAL INTERCONNECTS FOR MULTI-WAFER WAFER-SCALE INTEGRATED ARCHITECTURES.
Proceedings of SPIE - The International Society for Optical Engineering. 1986;679:57-62.0
